Invention Grant
- Patent Title: Semiconductor device with wirings of differing young's modulus and method for fabricating the same
- Patent Title (中): 具有不同年龄模量的布线的半导体器件及其制造方法
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Application No.: US13830586Application Date: 2013-03-14
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Publication No.: US09136403B2Publication Date: 2015-09-15
- Inventor: Masanori Ogura , Hideo Kobayashi , Tetsunobu Kochi , Masashi Kitani
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2012-103718 20120427
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L23/532 ; H01L27/146
Abstract:
In a semiconductor device including unit cells which are aligned in one direction, wirings disposed along end portions in the one direction have high Young's moduli.
Public/Granted literature
- US20130285189A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2013-10-31
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