Invention Grant
- Patent Title: Dual stripline tile circulator utilizing thick film post-fired substrate stacking
- Patent Title (中): 双带状平铺循环器利用厚膜后烧基板堆叠
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Application No.: US13952020Application Date: 2013-07-26
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Publication No.: US09136572B2Publication Date: 2015-09-15
- Inventor: James A. Carr , Mark B. Hanna
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01P1/387
- IPC: H01P1/387

Abstract:
A dual stacked stripline circulator includes multiple composite ferrite discs, each having an inner portion and an outer portion; a first substrate having an edge with a first composite ferrite disc disposed in the first substrate; a second substrate having an edge with a second composite ferrite disc disposed in the second substrate; a third substrate having an edge with a third composite ferrite disc disposed in the third substrate, the third substrate disposed adjacent the second substrate; a fourth substrate having an edge with a fourth composite ferrite disc disposed in the fourth substrate; a first pattern defining three ports of a first three-port circulator disposed between the first substrate and the second substrate; a second pattern defining three ports of a second three-port circulator disposed between the third substrate and the fourth substrate; and a metal film encircling the edge of the first, second, third and fourth substrate.
Public/Granted literature
- US20150028961A1 DUAL STRIPLINE TILE CIRCULATOR UTILIZING THICK FILM POST-FIRED SUBSTRATE STACKING Public/Granted day:2015-01-29
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