Invention Grant
US09136625B2 Connector assembly with plate for contact nesting and effective heat dissipation path
有权
连接器组件,带有用于接触嵌套和有效散热路径的板
- Patent Title: Connector assembly with plate for contact nesting and effective heat dissipation path
- Patent Title (中): 连接器组件,带有用于接触嵌套和有效散热路径的板
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Application No.: US14065016Application Date: 2013-10-28
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Publication No.: US09136625B2Publication Date: 2015-09-15
- Inventor: Wang-I Yu , Hung-Chi Tai , Yung-Chih Hung , Kuo-Cheng Liu
- Applicant: ALLTOP ELECTRONICS (SUZHOU) CO., LTD
- Applicant Address: CN Taicang
- Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee Address: CN Taicang
- Agency: Sughrue Mion, PLLC
- Priority: CN201310295105 20130715
- Main IPC: H01R13/523
- IPC: H01R13/523 ; H01R12/72 ; H01R12/70

Abstract:
A connector assembly includes a plug connector and a receptacle connector mateable with each other. The plug connector includes a plug insulative housing and a pair of plug power contacts. The plug insulative housing includes a first plug cavity, a first plate cantileveredly extending into the first plug cavity, and upper and lower plug contact slots in communication with the first plug cavity. The pair of plug power contacts are respectively received in the upper and lower plug contact slots. Each plug power contact includes a flat contacting section exposed to the first plug cavity and a first soldering section. The flat contacting sections are positioned on upper and lower surfaces of the first plate, respectively. The plug connector and the receptacle connector define heat dissipation channels in communication with each other in order that generating heat can be effectively dissipated to the air.
Public/Granted literature
- US20150017830A1 CONNECTOR ASSEMBLY WITH PLATE FOR CONTACT NESTING AND EFFECTIVE HEAT DISSIPATION PATH Public/Granted day:2015-01-15
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