Invention Grant
US09136793B2 Resonator element, resonator, electronic device, electronic apparatus, and method of manufacturing resonator element
有权
谐振器元件,谐振器,电子器件,电子设备和制造谐振元件的方法
- Patent Title: Resonator element, resonator, electronic device, electronic apparatus, and method of manufacturing resonator element
- Patent Title (中): 谐振器元件,谐振器,电子器件,电子设备和制造谐振元件的方法
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Application No.: US13910599Application Date: 2013-06-05
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Publication No.: US09136793B2Publication Date: 2015-09-15
- Inventor: Osamu Ishii
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-128661 20120606
- Main IPC: H03B5/32
- IPC: H03B5/32 ; H03H3/04 ; H03H9/02 ; H03H9/05 ; H03H9/10

Abstract:
A resonator element includes a substrate including a vibrating portion that performs thickness-shear vibration and an excitation electrode provided on top and bottom main surfaces of the vibrating portion. Assuming that the average plate thickness calculated from the plate thicknesses of a plurality of regions of the vibrating portion is H and the plate thickness difference, which is a difference between the maximum and minimum values of the plate thicknesses of the plurality of regions of the vibrating portion, is ΔH, 0%
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