Invention Grant
- Patent Title: Via structure for transmitting differential signals
- Patent Title (中): 通过差分信号传输结构
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Application No.: US13607338Application Date: 2012-09-07
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Publication No.: US09137887B2Publication Date: 2015-09-15
- Inventor: Gary Ellsworth Biddle , James Nadolny
- Applicant: Gary Ellsworth Biddle , James Nadolny
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K3/40
Abstract:
A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, and a first ground plane located on a layer below the top surface of the printed circuit board and including an antipad that encompasses the first and second signal pads and the first and second signal vias when viewed in plan.
Public/Granted literature
- US20130056255A1 VIA STRUCTURE FOR TRANSMITTING DIFFERENTIAL SIGNALS Public/Granted day:2013-03-07
Information query
