Invention Grant
- Patent Title: Method of providing a low footprint optical interconnect
- Patent Title (中): 提供低占地面积的光互连的方法
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Application No.: US13465603Application Date: 2012-05-07
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Publication No.: US09137889B1Publication Date: 2015-09-15
- Inventor: Randall C. Veitch , Thomas W. Stone
- Applicant: Randall C. Veitch , Thomas W. Stone
- Applicant Address: US PA Bethlehem
- Assignee: Wavefront Research, Inc.
- Current Assignee: Wavefront Research, Inc.
- Current Assignee Address: US PA Bethlehem
- Agency: Burns & Levinson LLP
- Agent Orlando Lopez
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K1/02
Abstract:
Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.
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