Invention Grant
- Patent Title: Laminated structure, method of manufacturing laminated structure, and electronic apparatus
- Patent Title (中): 叠层结构，层叠结构体的制造方法以及电子设备
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Application No.: US14082767Application Date: 2013-11-18
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Publication No.: US09137892B2Publication Date: 2015-09-15
- Inventor: Masashi Bando , Keisuke Shimizu , Koji Kadono , Nozomi Kimura , Toshiyuki Kobayashi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2012-257095 20121126
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/00 ; H05K1/02 ; G06F3/044 ; H05K3/46
Abstract:
A laminated structure includes a first substrate, an adhesive, a graphene, and a second substrate. The adhesive is provided on a principal surface of the first substrate, and the adhesive has a storage elastic modulus of 7.2*104 Pa or more and 6.1*105 Pa or less at 23° C. The graphene is bonded to the adhesive, and the graphene has one or a plurality of layers. The second substrate is bonded to the graphene.
Public/Granted literature
- US20140146490A1 LAMINATED STRUCTURE, METHOD OF MANUFACTURING LAMINATED STRUCTURE, AND ELECTRONIC APPARATUS Public/Granted day:2014-05-29
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