Invention Grant
- Patent Title: Bending device
- Patent Title (中): 弯曲装置
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Application No.: US13258584Application Date: 2010-04-08
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Publication No.: US09138795B2Publication Date: 2015-09-22
- Inventor: Teruaki Yogo
- Applicant: Teruaki Yogo
- Applicant Address: JP Seto-shi, Aichi
- Assignee: Kabushiki Kaisha Opton
- Current Assignee: Kabushiki Kaisha Opton
- Current Assignee Address: JP Seto-shi, Aichi
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Priority: JP2009-094094 20090408
- International Application: PCT/JP2010/056375 WO 20100408
- International Announcement: WO2010/117037 WO 20101014
- Main IPC: B21D7/024
- IPC: B21D7/024 ; B21D7/12
Abstract:
A bending device is provided with a bending mechanism, a fixing table, an articulated robot, and a control unit. Control performed by the control unit includes a bending/movement control in which a workpiece is moved by clamping the workpiece by the bending mechanism and moving the bending mechanism by the articulated robot, and the workpiece is bent by the bending mechanism while the workpiece is being moved.
Public/Granted literature
- US20120006088A1 BENDING DEVICE Public/Granted day:2012-01-12
Information query
