Invention Grant
- Patent Title: Three-dimensional modeling apparatus, model, and method of manufacturing a model
- Patent Title (中): 三维建模设备,模型和制造模型的方法
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Application No.: US13467351Application Date: 2012-05-09
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Publication No.: US09138939B2Publication Date: 2015-09-22
- Inventor: Hiroyuki Yasukochi
- Applicant: Hiroyuki Yasukochi
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2011-108989 20110516
- Main IPC: B28B1/16
- IPC: B28B1/16 ; B29C67/00

Abstract:
A three-dimensional modeling apparatus includes: a stage; a regulating body having a surface including a linear region along a first direction and being arranged to face the stage so that the linear region of the surface comes closest to the stage; a supply nozzle configured to supply a material to be cured by energy of an energy beam to a slit region which is a region between the stage and the linear region; a movement mechanism configured to move the regulating body and the stage relative to each other along a second direction other than the first direction to form a cured layer of the material for at least one layer; and an irradiation unit configured to irradiate the material supplied from the supply nozzle to the slit region with the energy beam under a state in which the stage and the regulating body rest relative to each other.
Public/Granted literature
- US20120295075A1 THREE-DIMENSIONAL MODELING APPARATUS, MODEL, AND METHOD OF MANUFACTURING A MODEL Public/Granted day:2012-11-22
Information query
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