Invention Grant
- Patent Title: Method and apparatus for adhesive bond curing
- Patent Title (中): 粘合剂固化的方法和装置
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Application No.: US13779095Application Date: 2013-02-27
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Publication No.: US09138971B2Publication Date: 2015-09-22
- Inventor: Gary E. Jones
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Hanley, Flight & Zimmerman, LLC.
- Main IPC: B29C70/74
- IPC: B29C70/74 ; B29C70/76 ; B32B37/00 ; B29C70/46 ; B29C70/88 ; B29C35/02 ; B29C35/16 ; B29K63/00 ; B29K707/04 ; B29L31/08

Abstract:
Portable apparatus for curing a part includes a wheeled frame having sliding part supports that move the part from a loading position to a curing position. A part clamping assembly is slidably mounted on the frame to apply clamping pressure to the part when the part is in the curing position in order to compact the part during a cure cycle. The clamping assembly includes a set of electrically heated shoes that heat the part to a cure temperature. A fan is provided to accelerate cool down the part after curing is complete. The heating and cooling operations are automatically performed by a programmed controller.
Public/Granted literature
- US20130168022A1 METHOD AND APPARATUS FOR ADHESIVE BOND CURING Public/Granted day:2013-07-04
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