Invention Grant
- Patent Title: Micro electro mechanical system structures
- Patent Title (中): 微机电系统结构
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Application No.: US13353765Application Date: 2012-01-19
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Publication No.: US09139423B2Publication Date: 2015-09-22
- Inventor: Ting-Ying Chien , Yi Hsun Chiu , Ching-Hou Su , Chyi-Tsong Ni
- Applicant: Ting-Ying Chien , Yi Hsun Chiu , Ching-Hou Su , Chyi-Tsong Ni
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L23/10 ; B81C1/00
Abstract:
A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure.
Public/Granted literature
- US20130187245A1 MICRO ELECTRO MECHANICAL SYSTEM STRUCTURES Public/Granted day:2013-07-25
Information query
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