Invention Grant
- Patent Title: Process to reduce nodule formation in electroless plating
- Patent Title (中): 在化学镀中减少结节形成的过程
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Application No.: US14276877Application Date: 2014-05-13
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Publication No.: US09142416B1Publication Date: 2015-09-22
- Inventor: Nanhai Li , Xiaomin Bin , Yaxin Wang , Marina Polyanskaya , Novy Tjokro , Artur Kolics
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Bayer Law Group LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/288 ; H01L21/768

Abstract:
A method for providing electroless deposition of a metal layer on a plurality of metal patterns, wherein a dielectric surface is between some of the plurality of metal patterns and metal residue is on the dielectric surface is provided. The dielectric surface is pretreated with an alkaline solution with a pH of at least 8 comprising at least one complexing agent, wherein the complexing agent forms a metal complex with the metal residue and wherein some metal oxide residue remains. The dielectric surface is pretreated with an acidic solution, wherein the acidic solution dissolves metal oxide residue. Metal is electrolessly deposited on the plurality of metal patterns.
Information query
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