Invention Grant
- Patent Title: Semiconductor package with corner pins
- Patent Title (中): 带角接头的半导体封装
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Application No.: US14040429Application Date: 2013-09-27
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Publication No.: US09142491B2Publication Date: 2015-09-22
- Inventor: Robert W. Warren , Hyun Jane Lee , Nic Rossi
- Applicant: Conexant Systems, Inc.
- Applicant Address: US CA Irvine
- Assignee: CONEXANT SYSTEMS, INC.
- Current Assignee: CONEXANT SYSTEMS, INC.
- Current Assignee Address: US CA Irvine
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/78 ; H01L21/56
Abstract:
There are provided semiconductor packages having corner pins and methods for their fabrication. Such a semiconductor package includes a leadframe and a die paddle, the leadframe having first and second edge sides meeting to form a first corner. The semiconductor package also includes edge pins arrayed substantially parallel to the first edge side and edge pins arrayed substantially parallel to the second edge side. In addition, the semiconductor package includes a first corner pin situated at the first corner, the first corner pin being electrically isolated from the die paddle.
Public/Granted literature
- US20140091448A1 Semiconductor Package with Corner Pins Public/Granted day:2014-04-03
Information query
IPC分类:
