Invention Grant
US09142531B1 Integrated circuit packaging system with plated leads and method of manufacture thereof
有权
具有电镀引线的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with plated leads and method of manufacture thereof
- Patent Title (中): 具有电镀引线的集成电路封装系统及其制造方法
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Application No.: US14219463Application Date: 2014-03-19
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Publication No.: US09142531B1Publication Date: 2015-09-22
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H01L21/56
Abstract:
An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die.
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