Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14473718Application Date: 2014-08-29
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Publication No.: US09142627B2Publication Date: 2015-09-22
- Inventor: Syotaro Ono , Masaru Izumisawa , Hideyuki Ura , Hiroaki Yamashita
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2014-003369 20140110
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/40 ; H01L29/06 ; H01L29/423

Abstract:
A semiconductor device includes a first layer of a first conductivity type between a first and a second electrode. A second layer of the first conductivity type is between the first layer and the second electrode. A pair of third layers of a second conductivity type has a first portion in the first layer and a second portion contacting the second layer. A fourth layer is between the second layer and the second electrode and between the third layers and the second electrode. A fifth layer is between the fourth layer and the second electrode. A third electrode is adjacent to the second layer via a first insulating film. A fourth electrode is between the second electrode and the third electrode and adjacent to the fourth semiconductor layer via a second insulating film. The second insulating film is thinner than the first insulating film.
Public/Granted literature
- US20150200248A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-07-16
Information query
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