Invention Grant
- Patent Title: Electronic component, and a method of manufacturing an electronic component
- Patent Title (中): 电子部件,以及电子部件的制造方法
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Application No.: US12663746Application Date: 2008-06-18
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Publication No.: US09142763B2Publication Date: 2015-09-22
- Inventor: Godefridus Adrianus Maria Hurkx
- Applicant: Godefridus Adrianus Maria Hurkx
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: EP07110692 20070620
- International Application: PCT/IB2008/052391 WO 20080618
- International Announcement: WO2008/155724 WO 20081224
- Main IPC: H01L47/00
- IPC: H01L47/00 ; H01L45/00

Abstract:
An electronic component (100), a first electrode (101), a second electrode (102), and a convertible structure (103) electrically coupled between the first electrode (101) and the second electrode (102), being convertible between at least two states by heating and having different electrical properties in different ones of the at least two states, wherein the convertible structure (103) comprises terminal portions (104, 105) connected to the first electrode (101) and to the second electrode (102), respectively, and comprises a line portion (106) between the terminal portions (104, 105), the line portion (106) having a smaller width or thickness than the terminal portions (104, 105), and wherein the convertible structure (103) is arranged with respect to the first electrode (101) and the second electrode (102) so that, in one of the at least two states, the line portion (106) has an amorphous ‘Spot (107) extending along only a part of the line portion (106).
Public/Granted literature
- US20100155685A1 ELECTRONIC COMPONENT, AND A METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT Public/Granted day:2010-06-24
Information query
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