A microelectromechanical (MEMS) package including a compressive system preferentially directs external forces, towards the MEMS sensor in a manner that affects several components of the Quality Factor (Q) of the MEMS system. Relatively rigid materials (force transfer elements) are added or deposited in strategic places along any of the edges, faces or corners of a MEMS sensor, followed by the addition of material, which by virtue of the annealing process, applies a compressive stress to all objects encased therein. As a result, vibrational modes are affected due to changes in the effective mass and spring constants of the total MEMS apparatus system, dampening particular modes and stabilizing the MEMS transducer since such modes cannot be spuriously activated due to environmental changes. By attenuating, or at least causing them to be constant, the spurious modes and their absorption of vibrational energy are predictable over all operating conditions and thus amenable to electronic controls, e.g., electrical compensation.