Invention Grant
- Patent Title: Pressure transducer substrate with self alignment feature
- Patent Title (中): 压力传感器基板具有自对准功能
-
Application No.: US13788255Application Date: 2013-03-07
-
Publication No.: US09146164B2Publication Date: 2015-09-29
- Inventor: Wico Hopman , George Van Der Donk , Maarten Van Noorden , Sean DiStefano
- Applicant: Wico Hopman , George Van Der Donk , Maarten Van Noorden , Sean DiStefano
- Applicant Address: US MA Attleboro
- Assignee: Sensata Technologies, Inc.
- Current Assignee: Sensata Technologies, Inc.
- Current Assignee Address: US MA Attleboro
- Agency: Chapin IP Law, LLC
- Main IPC: G01L7/08
- IPC: G01L7/08 ; G01L1/14 ; G01L9/00 ; G01L1/22
Abstract:
In an embodiment, an apparatus includes a first substrate. The first substrate may have a first side for accommodating a first diaphragm. The first substrate may also have a second side. The second side may include a polygonal-shaped depression that is sized to accommodate a second diaphragm associated with a second substrate. The first substrate and first diaphragm may be included in a first assembly and the second substrate and second diaphragm may be included in a second assembly. The first assembly and the second assembly may be included in a stack where at least a portion of the second diaphragm is positioned to fit inside the polygonal-shaped depression in the stack.
Public/Granted literature
- US20140251030A1 PRESSURE TRANSDUCER SUBSTRATE WITH SELF ALIGNMENT FEATURE Public/Granted day:2014-09-11
Information query
