Invention Grant
- Patent Title: X-ray stress measuring apparatus
- Patent Title (中): X射线应力测量仪
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Application No.: US13812575Application Date: 2011-07-29
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Publication No.: US09146203B2Publication Date: 2015-09-29
- Inventor: Hideo Toraya , Shigeru Munekawa
- Applicant: Hideo Toraya , Shigeru Munekawa
- Applicant Address: JP Tokyo
- Assignee: RIGAKU CORPORATION
- Current Assignee: RIGAKU CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2010-172594 20100730
- International Application: PCT/JP2011/067517 WO 20110729
- International Announcement: WO2012/015046 WO 20120202
- Main IPC: G01N23/20
- IPC: G01N23/20 ; G01N23/207 ; G01L1/25 ; G01L1/00 ; G01B15/00

Abstract:
An X-ray stress measuring apparatus, for measuring stress on a sample, comprises: a pair of X-ray generating means (10, 11, 10′, 11′) for irradiating X-ray beams, determining an angle defined between the X-ray beams, mutually, at an arbitrary fixed angle, on a plane inclining by an angle desired with respect to a surface of the sample to be measured stress thereon; an X-ray sensor portion (29) for detecting plural numbers of Debye rings (C, C′), which are generated by incident X-ray beams from said pair of X-ray generating means; and a battery (410) for supplying necessary electricity to each of parts of the apparatus, wherein said X-ray sensor portion is made up with only one (1) piece of a 2-dimensional X-ray detector (20) or a 1-dimensional X-ray detector (20′), and is disposed in a position where the plural numbers of Debye rings generated by the incident X-ray beams from the at least one pair of X-ray generating means are adjacent to each other, or intersect with each other, thereby detecting the plural numbers of the Debye rings caused due to the X-ray and the X′-ray in common with.
Public/Granted literature
- US20130121470A1 X-RAY STRESS MEASURING APPARATUS Public/Granted day:2013-05-16
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