In accordance with aspects of the disclosure, a system and methods for thermal management of at least one processor positioned within a computing device include drawing external fluid into an enclosure of the computing device via an inlet aperture with use of at least one active pump positioned within the enclosure, directing the drawn fluid from the inlet aperture through an inlet channel formed within the enclosure to the active pump, passing the drawn fluid over the processor positioned within the enclosure by directing the drawn fluid from the active pump through an outlet channel formed within the enclosure, and expelling the drawn fluid from the enclosure of the computing device via an outlet aperture with use of the active pump after passing the drawn fluid over the processor so as to provide thermal management of the processor.