Invention Grant
US09146792B2 Evaluating reliability of a software module using development life cycle
有权
使用开发生命周期评估软件模块的可靠性
- Patent Title: Evaluating reliability of a software module using development life cycle
- Patent Title (中): 使用开发生命周期评估软件模块的可靠性
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Application No.: US13784341Application Date: 2013-03-04
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Publication No.: US09146792B2Publication Date: 2015-09-29
- Inventor: John J. Bird , Terry R. Ulmer
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Roy W. Truelson
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/34

Abstract:
Reliability of one or more software modules is projected according to a current state in a development life cycle of the software modules and any of various additional indicators. Preferably, a data processing support provider separate from the service-providing enterprise maintains historical field support data concerning significant field defect events with respect to various resources, and uses this data for projecting reliability of the resources. Preferably, software module reliability projections are used to support an analysis of risk of degradation of a service specified in a service requirements specification when provided by a configuration of data processing resources specified in a configuration specification.
Public/Granted literature
- US20140157063A1 Evaluating Reliability of a Software Module Using Development Life Cycle Public/Granted day:2014-06-05
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