Invention Grant
US09147102B2 Method and system for measuring bumps based on phase and amplitude information
有权
基于相位和幅度信息测量凸块的方法和系统
- Patent Title: Method and system for measuring bumps based on phase and amplitude information
- Patent Title (中): 基于相位和幅度信息测量凸块的方法和系统
-
Application No.: US13342119Application Date: 2012-01-02
-
Publication No.: US09147102B2Publication Date: 2015-09-29
- Inventor: Shimon Koren , Or Shur , Yacov Malinovich , Gilad Golan
- Applicant: Shimon Koren , Or Shur , Gilad Golan
- Applicant Address: IL Migdal Haemek
- Assignee: CAMTEK LTD.
- Current Assignee: CAMTEK LTD.
- Current Assignee Address: IL Migdal Haemek
- Agency: Reches Patents
- Main IPC: G06K9/32
- IPC: G06K9/32 ; G06K9/00 ; G02B21/00 ; G01N21/956 ; G01B11/06
Abstract:
A method and device for measuring a height of a microscopic structure such as solder bumps. For simplicity of explanation, the invention is described with respect to phase information and amplitude information wherein phase detection and calculation algorithms are being used.
Public/Granted literature
- US20130170712A1 METHOD AND SYSTEM FOR MEASURING BUMPS BASED ON PHASE AND AMPLITUDE INFORMATION Public/Granted day:2013-07-04
Information query
