Invention Grant
- Patent Title: Rotating curing
- Patent Title (中): 旋转固化
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Application No.: US13297390Application Date: 2011-11-16
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Publication No.: US09147584B2Publication Date: 2015-09-29
- Inventor: Jing Ruei Lu , Yu-Chih Liu , Ming-Chung Sung , Wei-Ting Lin , Chien-Kuo Chang
- Applicant: Jing Ruei Lu , Yu-Chih Liu , Ming-Chung Sung , Wei-Ting Lin , Chien-Kuo Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/29 ; H01L21/56 ; H01L21/67 ; H01L21/687
Abstract:
A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like.
Public/Granted literature
- US20130119565A1 Rotating Curing Public/Granted day:2013-05-16
Information query
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