Invention Grant
- Patent Title: Extremely thin package
- Patent Title (中): 非常薄的包装
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Application No.: US14032696Application Date: 2013-09-20
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Publication No.: US09147629B2Publication Date: 2015-09-29
- Inventor: Chia Chuan Chen , Lung-Pao Chin , I-Kuo Lin
- Applicant: Silego Technology, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Silego Technology, Inc.
- Current Assignee: Silego Technology, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/495 ; H01L23/00 ; H01L23/544 ; H01L21/683
Abstract:
Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.
Public/Granted literature
- US20140084429A1 EXTREMELY THIN PACKAGE Public/Granted day:2014-03-27
Information query
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