Invention Grant
US09147667B2 Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
有权
具有插入件上的面对面芯片的半导体器件及其制造方法
- Patent Title: Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
- Patent Title (中): 具有插入件上的面对面芯片的半导体器件及其制造方法
-
Application No.: US14523892Application Date: 2014-10-26
-
Publication No.: US09147667B2Publication Date: 2015-09-29
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: BRIDGE SEMICONDUCTOR CORPORATION
- Applicant Address: TW Taipei
- Assignee: BRIDGE SEMICONDUCTOR CORPORATION
- Current Assignee: BRIDGE SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/538 ; H01L23/34 ; H01L23/13 ; H01L23/367 ; H01L21/56 ; H01L23/544 ; H01L23/373 ; H01L23/42
Abstract:
A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.
Public/Granted literature
- US20150118794A1 SEMICONDUCTOR DEVICE WITH FACE-TO-FACE CHIPS ON INTERPOSER AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-04-30
Information query
IPC分类:
