A method for manufacturing an SMT LED device includes steps: providing an LED with two solder slugs extending downwardly from a bottom thereof; providing a circuit board with two first solder pads spaced from each other thereon, the first solder pads each defining a positioning hole therein corresponding to a position of each of the two solder slugs, forming a pair of second solder pads on the circuit board by directly and physically contacting with the circuit board; putting the solder slugs into the positioning holes; subjecting the circuit board and the LED to a reflow soldering, during which the solder slugs are first melted and then solidified to electrically and mechanically connect with the first and second solder pads thereby connecting the LED and the circuit board together.