Invention Grant
- Patent Title: Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device
- Patent Title (中): 填充有大量荧光体的波长转换片,使用该片材的发光半导体器件的制造方法以及发光半导体器件
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Application No.: US13671080Application Date: 2012-11-07
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Publication No.: US09147818B2Publication Date: 2015-09-29
- Inventor: Toshio Shiobara , Tsutomu Kashiwagi , Miyuki Wakao
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Chiyoda-ku
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-243267 20111107
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/56 ; C09K11/77 ; H01L33/50 ; H05B33/14 ; H05B33/20 ; C09D183/04 ; C09K11/02 ; C08G77/12 ; C08G77/14 ; C08G77/20

Abstract:
A wavelength conversion sheet filled with a large amount of phosphor, enabling the phosphor to be easily dispersed uniformly and in a large amount near the surface of an LED element. Specifically, the sheet includes: a layer formed from a heat-curable resin composition, which contains 100 parts by mass of a resin component and 100 to 2,000 parts by mass of a particulate phosphor in which the proportion of particles having a sphericity of 0.7 to 1.0 is not less than 60% of all the particles, and which exists in a plastic solid or semisolid state in an uncured state at normal temperature, wherein the average particle diameter of the phosphor is not more than 60% of the thickness of the layer formed from the heat-curable resin composition, and the maximum particle diameter thereof is not more than 90% thereof.
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