Invention Grant
- Patent Title: Busbar connection assembly
- Patent Title (中): 母线连接组件
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Application No.: US14568963Application Date: 2014-12-12
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Publication No.: US09147948B2Publication Date: 2015-09-29
- Inventor: Kelsey Michelle Wildstone , Rick Alan Vogt
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: AMAZON TECHNOLOGIES, INC.
- Current Assignee: AMAZON TECHNOLOGIES, INC.
- Current Assignee Address: US WA Seattle
- Agency: Thomas | Horstemeyer, LLP
- Main IPC: H01R4/60
- IPC: H01R4/60 ; H02J9/04 ; H02J9/06 ; H01R4/42 ; H01R25/14
Abstract:
Various embodiments of a busbar connection assembly comprise a first conductive plate and a second conductive plate. A slot is formed between the first conductive plate and the second conductive plate, and the slot receives a busbar plate of a datacenter power bus. A power cable electrically couples to the first conductive plate and the second conductive plate.
Public/Granted literature
- US20150097436A1 Busbar Connection Assembly Public/Granted day:2015-04-09
Information query
