Invention Grant
- Patent Title: Micro electrical mechanical system with bending deflection of backplate structure
- Patent Title (中): 微电子机械系统具有背板结构的弯曲偏转
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Application No.: US13230264Application Date: 2011-09-12
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Publication No.: US09148726B2Publication Date: 2015-09-29
- Inventor: Alfons Dehe
- Applicant: Alfons Dehe
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H04R7/14
- IPC: H04R7/14 ; H04R7/12 ; B81C1/00 ; G01L9/00 ; H04R7/24 ; H04R31/00 ; H04R1/00 ; H04R19/00
Abstract:
A micro electrical mechanical system includes a membrane structure and a backplate structure. The backplate structure includes a backplate material and at least one pre-tensioning element mechanically connected to the backplate material. The at least one pre-tensioning element causes a mechanical tension on the backplate material for a bending deflection of the backplate structure in a direction away from the membrane structure.
Public/Granted literature
- US20130062710A1 Micro Electrical Mechanical System with Bending Deflection of Backplate Structure Public/Granted day:2013-03-14
Information query
