Invention Grant
- Patent Title: Method and apparatus for heating up integrated circuits
- Patent Title (中): 用于加热集成电路的方法和装置
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Application No.: US13680900Application Date: 2012-11-19
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Publication No.: US09148910B1Publication Date: 2015-09-29
- Inventor: Arik Mimran , Ziv Harel
- Applicant: Marvell Israel (M.I.S.L) Ltd.
- Applicant Address: IL Yokneam
- Assignee: Marvell Israel (M.I.S.L.) Ltd.
- Current Assignee: Marvell Israel (M.I.S.L.) Ltd.
- Current Assignee Address: IL Yokneam
- Main IPC: H05B1/02
- IPC: H05B1/02 ; H05B1/00

Abstract:
Aspects of the disclosure provide an integrated circuit (IC) chip that includes a heating element and a heating control circuit. The heating element is configured to be controllable to generate heat. The heating control circuit is configured to be operable when an IC chip temperature is below a threshold. The heating control circuit is configured to receive a signal indicative of a sensed temperature and control the heating element to generate heat to raise the IC chip temperature when the sensed temperature is below the threshold.
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