Invention Grant
US09148910B1 Method and apparatus for heating up integrated circuits 有权
用于加热集成电路的方法和装置

Method and apparatus for heating up integrated circuits
Abstract:
Aspects of the disclosure provide an integrated circuit (IC) chip that includes a heating element and a heating control circuit. The heating element is configured to be controllable to generate heat. The heating control circuit is configured to be operable when an IC chip temperature is below a threshold. The heating control circuit is configured to receive a signal indicative of a sensed temperature and control the heating element to generate heat to raise the IC chip temperature when the sensed temperature is below the threshold.
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