Invention Grant
US09148971B2 Component built-in module, electronic device including same, and method for manufacturing component built-in module
有权
组件内置模块，包括其的电子设备以及组件内置模块的制造方法
- Patent Title: Component built-in module, electronic device including same, and method for manufacturing component built-in module
- Patent Title (中): 组件内置模块，包括其的电子设备以及组件内置模块的制造方法
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Application No.: US13824479Application Date: 2011-07-08
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Publication No.: US09148971B2Publication Date: 2015-09-29
- Inventor: Nozomu Nishimura , Nobuhiro Mikami
- Applicant: Nozomu Nishimura , Nobuhiro Mikami
- Applicant Address: HK Quarry Bay
- Assignee: LENOVO INNOVATIONS LIMITED (HONG KONG)
- Current Assignee: LENOVO INNOVATIONS LIMITED (HONG KONG)
- Current Assignee Address: HK Quarry Bay
- Priority: JPP2010-232321 20101015
- International Application: PCT/JP2011/065700 WO 20110708
- International Announcement: WO2012/049895 WO 20120419
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K3/28 ; H01L23/31 ; H01L21/56 ; H05K3/30
Abstract:
A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.
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