Invention Grant
US09148974B2 Serial connection riser cards including parallel connection memory modules
有权
串行连接提升卡，包括并行连接内存模块
- Patent Title: Serial connection riser cards including parallel connection memory modules
- Patent Title (中): 串行连接提升卡，包括并行连接内存模块
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Application No.: US13331940Application Date: 2011-12-20
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Publication No.: US09148974B2Publication Date: 2015-09-29
- Inventor: Martin Goldstein , Hau Jiun Chen , Mun Hoong Tai , Choon Pheng Tan
- Applicant: Martin Goldstein , Hau Jiun Chen , Mun Hoong Tai , Choon Pheng Tan
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Wood Phillips
- Main IPC: H01R43/20
- IPC: H01R43/20 ; H05K7/14 ; H01R12/71 ; H05K1/14
Abstract:
A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.
Public/Granted literature
Information query
