Invention Grant
- Patent Title: Tamper resistant pharmaceutical formulations
- Patent Title (中): 防篡改药物制剂
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Application No.: US14172447Application Date: 2014-02-04
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Publication No.: US09149533B2Publication Date: 2015-10-06
- Inventor: Debora Guido , Haiyong Hugh Huang
- Applicant: Purdue Pharma L.P.
- Applicant Address: US CT Stamford
- Assignee: Purdue Pharma L.P.
- Current Assignee: Purdue Pharma L.P.
- Current Assignee Address: US CT Stamford
- Agency: Lowenstein Sandler LLP
- Main IPC: A61K9/26
- IPC: A61K9/26 ; A61K31/44 ; A61K47/36 ; A61K9/20 ; A61K31/485 ; A61K31/165 ; A61K31/167 ; A61K47/02 ; A61K47/32
Abstract:
Disclosed in certain embodiments is a solid oral dosage form comprising a heat-labile gelling agent; a thermal stabilizer; and a drug susceptible to abuse.
Public/Granted literature
- US20140221416A1 Tamper Resistant Pharmaceutical Formulations Public/Granted day:2014-08-07
Information query
