Invention Grant
- Patent Title: Modified layer forming method
- Patent Title (中): 改性层形成方法
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Application No.: US13893783Application Date: 2013-05-14
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Publication No.: US09149886B2Publication Date: 2015-10-06
- Inventor: Kazuma Sekiya
- Applicant: Disco Corporation
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JP2012-113573 20120517
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/08

Abstract:
A modified layer forming method of applying a pulsed laser beam having a transmission wavelength to a workpiece through a predetermined beam entrance surface in the condition where the focal point of the pulsed laser beam is set inside the workpiece, thereby forming a desired modified layer inside the workpiece. The modified layer forming method includes the step of reducing the power of the pulsed laser beam to a power that cannot process the workpiece when a surface adjacent to the beam entrance surface of the workpiece is located at the beam entrance position of the pulsed laser beam.
Public/Granted literature
- US20130306605A1 MODIFIED LAYER FORMING METHOD Public/Granted day:2013-11-21
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