A soldering device for plastics adhering includes a handle having two protruded rings and a button assembly, a body having a pivoting portion and a head portion, the body pivotally rotated relative to the handle in a certain angle between the body and the handle, two conducting rods electrically connected to the button assembly, one end of each conducting rod inserted into the body, another end of each conducting rod exposed out from the body, an electrical storage element assembled into the handle and electrically connected to the button assembly and the two conducting rods. Therefore, when a user presses the button assembly, a unit of electricity is delivered to the conducting rod, so that an amount of heat is generated to adhere or repair an article.