Invention Grant
US09150758B2 Polishing composition, polishing method using same, and method for producing semiconductor device 有权
抛光组合物,使用其的研磨方法,以及半导体装置的制造方法

Polishing composition, polishing method using same, and method for producing semiconductor device
Abstract:
The polishing composition of the present invention contains an oxidizing agent and a scratch-reducing agent represented by general formula (1) or (2) below. In the formulas, X1 and X2 are each independently a hydrogen atom, a hydroxyl group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, an alkyl polyamine group, an alkyl polyphosphate group, an alkyl polycarboxylate group, an alkyl polyaminopolyphosphate group, or an alkyl polyaminopolycarboxylate group.
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