Invention Grant
US09150758B2 Polishing composition, polishing method using same, and method for producing semiconductor device
有权
抛光组合物,使用其的研磨方法,以及半导体装置的制造方法
- Patent Title: Polishing composition, polishing method using same, and method for producing semiconductor device
- Patent Title (中): 抛光组合物,使用其的研磨方法,以及半导体装置的制造方法
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Application No.: US14007272Application Date: 2012-03-28
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Publication No.: US09150758B2Publication Date: 2015-10-06
- Inventor: Anne Miller , Chiaki Saito , Kanako Fukuda
- Applicant: Anne Miller , Chiaki Saito , Kanako Fukuda
- Applicant Address: JP Kiyosu-Shi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-Shi
- Agency: Foley & Lardner LLP
- International Application: PCT/JP2012/058258 WO 20120328
- International Announcement: WO2012/133591 WO 20121004
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; B44C1/22 ; C23F1/00 ; C03C15/00 ; C03C25/68 ; C09G1/02 ; H01L21/304 ; H01L21/321 ; B24B37/04 ; C09K3/14 ; H01L21/306 ; H01L21/768 ; C09G1/00 ; C09G1/04

Abstract:
The polishing composition of the present invention contains an oxidizing agent and a scratch-reducing agent represented by general formula (1) or (2) below. In the formulas, X1 and X2 are each independently a hydrogen atom, a hydroxyl group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, an alkyl polyamine group, an alkyl polyphosphate group, an alkyl polycarboxylate group, an alkyl polyaminopolyphosphate group, or an alkyl polyaminopolycarboxylate group.
Public/Granted literature
- US20140141612A1 POLISHING COMPOSITION, POLISHING METHOD USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Public/Granted day:2014-05-22
Information query
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