Invention Grant
- Patent Title: Multi-component solid solution alloys having high mixing entropy
- Patent Title (中): 具有高混合熵的多组分固溶体合金
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Application No.: US13283078Application Date: 2011-10-27
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Publication No.: US09150945B2Publication Date: 2015-10-06
- Inventor: Hongbin Bei
- Applicant: Hongbin Bei
- Applicant Address: US TN Oak Ridge
- Assignee: UT-BATTELLE, LLC
- Current Assignee: UT-BATTELLE, LLC
- Current Assignee Address: US TN Oak Ridge
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: C22C9/04
- IPC: C22C9/04 ; C22C30/00 ; C22C1/02 ; C22C9/06 ; C22C19/05 ; C22C19/07 ; C22C27/02 ; C22C27/06 ; C22C30/02
Abstract:
A multi-component high-entropy alloy includes a composition selected from the following group: VNbTaTiMoWRe, VNbTaTiMoW, VNbTaTiMoRe, VNbTaTiWRe, VNbTaMoWRe, VNbTiMoWRe, VTaTiMoWRe, NbTaTiMoWRe, VNbTaTiMo, VNbTaTiW, VNbTaMoW, VNbTiMoW, VTaTiMoW, NbTaTiMoW, VNbTaTiRe, VNbTaMoRe, VNbTiMoRe, VTaTiMoRe, NbTaTiMoRe, VNbTaWRe, VNbTiWRe, VTaTiWRe, NbTaTiWRe, VNbMoWRe, VTaMoWRe, NbTaMoWRe, VTiMoWRe, NbTiMoWRe, TaTiMoWRe, wherein relative amounts of each element vary by no more than ±15 atomic %.
Public/Granted literature
- US20130108502A1 Multi-Component Solid Solution Alloys having High Mixing Entropy Public/Granted day:2013-05-02
Information query
