Invention Grant
- Patent Title: Method of removing a metal detail from a substrate
- Patent Title (中): 从基板去除金属细节的方法
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Application No.: US13962296Application Date: 2013-08-08
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Publication No.: US09150980B2Publication Date: 2015-10-06
- Inventor: Robert T. Loftus, Jr. , Robert L. Knicely , Nicklaus C. Kimball
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: C25F3/02
- IPC: C25F3/02 ; C25F3/14 ; C25F5/00 ; B64C11/20 ; B64C27/473

Abstract:
A method of removing a metal detail from a dielectric material of an article may include placing the article in an electrolyte bath such that at least a portion of the metal detail is submerged. The metal detail may be coupled to a dielectric material. The method may further include positioning at least one cathode in the electrolyte bath in spaced relation to the metal detail, and passing electrical current through the metal detail. The method may additionally include deplating the metal detail from the dielectric material in response to passing the electrical current through the metal detail.
Public/Granted literature
- US20150041330A1 METHOD OF REMOVING A METAL DETAIL FROM A SUBSTRATE Public/Granted day:2015-02-12
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