Invention Grant
- Patent Title: Low capacitance finFET gate structure
- Patent Title (中): 低电容finFET栅极结构
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Application No.: US14167197Application Date: 2014-01-29
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Publication No.: US09153669B2Publication Date: 2015-10-06
- Inventor: Brent A. Anderson , Andres Bryant , Edward J. Nowak
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Michael J. LeStrange
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/66 ; H01L29/78

Abstract:
Low capacitance finFET gate structures and methods of manufacturing. The method includes forming a layer of material on a substrate. The method further includes forming a dummy gate structure on the substrate which abuts the layer of material. The method further includes forming at least one spacer adjacent to the dummy gate structure and the layer of material. The method further includes removing the dummy gate structure and at least a portion of the layer of material to form an opening with a varying length. The method further includes forming a replacement gate structure with varying length by depositing gate material in the opening with the varying length.
Public/Granted literature
- US20150214325A1 LOW CAPACITANCE FINFET GATE STRUCTURE Public/Granted day:2015-07-30
Information query
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