Invention Grant
- Patent Title: Method of attaching a light emitting device to a support substrate
- Patent Title (中): 将发光元件安装在支撑基板上的方法
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Application No.: US14118564Application Date: 2012-05-21
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Publication No.: US09153758B2Publication Date: 2015-10-06
- Inventor: Daniel Alexander Steigerwald , Jérôme Chandra Bhat , Salman Akram
- Applicant: Daniel Alexander Steigerwald , Jérôme Chandra Bhat , Salman Akram
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Agency: Patent Law Group LLP
- Agent Rachel V. Leiterman
- International Application: PCT/IB2012/052533 WO 20120521
- International Announcement: WO2012/164431 WO 20121206
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/62 ; H01L33/48 ; H01L33/50 ; H01L33/00
Abstract:
A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.
Public/Granted literature
- US20140220716A1 METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE Public/Granted day:2014-08-07
Information query
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