Invention Grant
US09155194B1 Memory interconnect arrangement having high data transfer speed signal integrity
有权
具有高数据传输速度信号完整性的存储器互连布置
- Patent Title: Memory interconnect arrangement having high data transfer speed signal integrity
- Patent Title (中): 具有高数据传输速度信号完整性的存储器互连布置
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Application No.: US13535529Application Date: 2012-06-28
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Publication No.: US09155194B1Publication Date: 2015-10-06
- Inventor: Kenneth M. Sullivan , Adrianus Djohan , Jonathan C. Giffen , Lawrence J. Feroli , John Phinney , Kranti Uppala
- Applicant: Kenneth M. Sullivan , Adrianus Djohan , Jonathan C. Giffen , Lawrence J. Feroli , John Phinney , Kranti Uppala
- Applicant Address: US MA Hopkinton
- Assignee: EMC Corporation
- Current Assignee: EMC Corporation
- Current Assignee Address: US MA Hopkinton
- Agent Krishnendu Gupta; Konrad R. Lee
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/11 ; H05K1/14
Abstract:
An arrangement having a processor electrically to, and mounted on, a portion of a surface of a motherboard. A plurality of memory cards is plugged into memory board slot type connectors on a surface of the memory card printed circuit board with the surface of the memory card printed circuit board being perpendicular to the surface of the motherboard. A right angle backplane connector has a first end disposed perpendicular to, and electrically connected to the surface of a motherboard and a second end disposed on the surface of, and electrically connected to, the memory card printed circuit board. The plurality of memory cards is parallel to the surface of the motherboard. An ejector mechanism is provided for removing the memory printed circuit board from an electrical connector receptacle mounted to the motherboard by camming action.
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