In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1). The body (2) itself can also be configured so as to be resilient by way of incisions (6) and/or equipped with a plug-in lug (5).