Invention Grant
- Patent Title: Flex-rigid printed wiring board and manufacturing method thereof
- Patent Title (中): 柔性刚性印刷线路板及其制造方法
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Application No.: US13459628Application Date: 2012-04-30
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Publication No.: US09155209B2Publication Date: 2015-10-06
- Inventor: Akihiro Sato , Masahiro Sasaki , Tadahiro Ohmi , Akihiro Morimoto
- Applicant: Akihiro Sato , Masahiro Sasaki , Tadahiro Ohmi , Akihiro Morimoto
- Applicant Address: JP Tokyo JP Miyagi
- Assignee: DAISHO DENSHI CO., LTD.,TOHOKU UNIVERSITY
- Current Assignee: DAISHO DENSHI CO., LTD.,TOHOKU UNIVERSITY
- Current Assignee Address: JP Tokyo JP Miyagi
- Agency: Wood, Herron & Evans, LLP
- Main IPC: H05K3/06
- IPC: H05K3/06 ; H05K3/46 ; C23F1/02 ; C23F1/18 ; C23F4/04 ; C23F4/00 ; H05K3/24

Abstract:
A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf