Invention Grant
US09155209B2 Flex-rigid printed wiring board and manufacturing method thereof 有权
柔性刚性印刷线路板及其制造方法

Flex-rigid printed wiring board and manufacturing method thereof
Abstract:
A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf
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