Invention Grant
US09155236B2 Composition and methods of forming solder bump and flip chip using the same
有权
使用其形成焊料凸块和倒装芯片的组成和方法
- Patent Title: Composition and methods of forming solder bump and flip chip using the same
- Patent Title (中): 使用其形成焊料凸块和倒装芯片的组成和方法
-
Application No.: US14325517Application Date: 2014-07-08
-
Publication No.: US09155236B2Publication Date: 2015-10-06
- Inventor: Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2008-0067117 20080710; KR10-2009-0011106 20090211
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K13/04 ; B23K3/06 ; B23K35/34 ; B23K35/36 ; B82Y10/00 ; B23K35/24 ; H05K3/32 ; H05K3/34
Abstract:
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
Public/Granted literature
- US20140317918A1 COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME Public/Granted day:2014-10-30
Information query
