Invention Grant
- Patent Title: Soft polishing pad for polishing a semiconductor substrate
- Patent Title (中): 用于抛光半导体衬底的软抛光垫
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Application No.: US12832908Application Date: 2010-07-08
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Publication No.: US09156124B2Publication Date: 2015-10-13
- Inventor: William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
- Applicant: William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
- Applicant Address: US OR Hilsboro
- Assignee: NexPlanar Corporation
- Current Assignee: NexPlanar Corporation
- Current Assignee Address: US OR Hilsboro
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24B37/20 ; B32B7/06 ; B32B27/06 ; B32B27/36 ; B32B3/30
Abstract:
Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
Public/Granted literature
- US20120009855A1 SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE Public/Granted day:2012-01-12
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