Invention Grant
US09157145B2 Processing tool with combined sputter and evaporation deposition sources
有权
具有组合溅射和蒸发沉积源的加工工具
- Patent Title: Processing tool with combined sputter and evaporation deposition sources
- Patent Title (中): 具有组合溅射和蒸发沉积源的加工工具
-
Application No.: US12512010Application Date: 2009-07-29
-
Publication No.: US09157145B2Publication Date: 2015-10-13
- Inventor: D. Guy Eristoff , Michael S. Barnes , Arthur C. Wall , Terry Bluck
- Applicant: D. Guy Eristoff , Michael S. Barnes , Arthur C. Wall , Terry Bluck
- Applicant Address: US CA Santa Clara
- Assignee: INTEVAC, INC.
- Current Assignee: INTEVAC, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Nixon Peabody LLP
- Agent Joseph Bach, Esq.
- Main IPC: C23C18/54
- IPC: C23C18/54 ; C23C14/34 ; C23C14/22 ; C23C14/24 ; C23C14/56

Abstract:
A substrate processing system particularly suitable for fabricating solar cells. The system has a front end module transporting cassettes, each cassette holding a preset number of substrates therein; a loading module coupled to the front end module and having mechanism for loading substrates from the cassettes onto carriers; and a plurality of processing chambers coupled to each other in series, each having tracks for transporting the carriers directly from one chamber to the next; wherein selected chambers of the plurality of processing chambers comprise at least one combination source having a sputtering module and an evaporation module arranged linearly in the direction of travel of the carriers.
Public/Granted literature
- US20100024731A1 PROCESSING TOOL WITH COMBINED SPUTTER AND EVAPORATION DEPOSITION SOURCES Public/Granted day:2010-02-04
Information query
IPC分类: