Invention Grant
- Patent Title: Connecting structure and connecting method of insulated wires
- Patent Title (中): 绝缘电线的连接结构和连接方法
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Application No.: US13807762Application Date: 2011-07-05
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Publication No.: US09159474B2Publication Date: 2015-10-13
- Inventor: Naoki Ito
- Applicant: Naoki Ito
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-153087 20100705
- International Application: PCT/JP2011/065392 WO 20110705
- International Announcement: WO2012/005258 WO 20120112
- Main IPC: H01R4/12
- IPC: H01R4/12 ; H01B13/00 ; H01R4/02 ; H01R43/02 ; H01B7/00

Abstract:
A connecting structure includes a sheathing connecting section in which sheathed sections of a plurality of electric wires, which are sections at both sides of exposed conductor sections, are bundled together in a state of being superimposed with each other; and a conductor connecting section in which the conductor sections of the plurality of electric wires are intertwined in a state of being folded back, and a section of the folded back conductor section remaining as a result of excluding a portion of the folded back conductor section are ultrasonically bonded in integration.
Public/Granted literature
- US20130092414A1 CONNECTING STRUCTURE AND CONNECTING METHOD OF INSULATED WIRES Public/Granted day:2013-04-18
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