Invention Grant
- Patent Title: Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unit
- Patent Title (中): 固体电解电容器封装结构及其制造方法及导电单元
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Application No.: US14148915Application Date: 2014-01-07
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Publication No.: US09159490B2Publication Date: 2015-10-13
- Inventor: Chi-Hao Chiu , Ming-Tsung Chen , Kun-Huang Chang
- Applicant: APAQ TECHNOLOGY CO., LTD.
- Applicant Address: TW Miaoli County
- Assignee: APAQ TECHNOLOGY CO., LTD.
- Current Assignee: APAQ TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Miaoli County
- Agency: Li & Cai Intellectual Property (USA) Office
- Main IPC: H01G2/10
- IPC: H01G2/10 ; H01G9/15 ; H01G9/00 ; H01G9/052

Abstract:
A solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal. The first conductive terminal includes a first core layer and a first enclosing layer. The first core layer has a first top exposed surface exposed from the first enclosing layer, and the first top exposed surface has a first top covering area covered by the package body. The second conductive terminal includes a second core layer and a second enclosing layer. The second core layer has a second top exposed surface exposed from the second enclosing layer, and the second top exposed surface has a second top covering area covered by the package body.
Public/Granted literature
- US20150194262A1 SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND CONDUCTIVE UNIT Public/Granted day:2015-07-09
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