Invention Grant
- Patent Title: Alleviation of the corrosion pitting of chip pads
- Patent Title (中): 缓解芯片焊盘的腐蚀点蚀
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Application No.: US14021288Application Date: 2013-09-09
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Publication No.: US09159556B2Publication Date: 2015-10-13
- Inventor: Ward A. Johnson
- Applicant: International Business Machines Corporation
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Agent Anthony J. Canale
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/66
Abstract:
Methods for processing a metal pad of a chip and chip structures including a chip with a metal pad. A surface modification agent is applied to the metal pad on the chip. The surface modification agent is effective to increase the hydrophobicity of the metal pad and may involve silylation.
Public/Granted literature
- US20150069631A1 ALLEVIATION OF THE CORROSION PITTING OF CHIP PADS Public/Granted day:2015-03-12
Information query
IPC分类:
