Invention Grant
- Patent Title: Wiring substrate and manufacturing method thereof
- Patent Title (中): 接线基板及其制造方法
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Application No.: US13939442Application Date: 2013-07-11
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Publication No.: US09159648B2Publication Date: 2015-10-13
- Inventor: Naoyuki Koizumi , Jun Furuichi , Yasuyoshi Horikawa
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano-Shi
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano-Shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2012-157907 20120713
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/48 ; H05K1/02 ; H05K3/46 ; H01L23/13 ; H01L23/15 ; H01L23/00 ; H05K3/00 ; H01L23/498

Abstract:
A wiring substrate includes: a core substrate made of glass and having: a first surface; a second surface opposite to the first surface; and a side surface between the first surface and the second surface; and an insulating layer and a wiring layer, which are formed on at least one of the first surface and the second surface of the core substrate. A plurality of concave portions are formed in the side surface of the core substrate to extend from the first surface to the second surface, and a resin is filled in the respective concave portions.
Public/Granted literature
- US20140015121A1 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-01-16
Information query
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